2024 International Conference Applied Mechanics and Semiconductors
Scopes
Mechanics and Engineering
Materials Mechanics
elastic mechanics
solid mechanics
fluid mechanics
hydraulics
Soil mechanics
rock mechanics
structural mechanics
Explosive mechanics
Aerodynamics
Plastic fracture and damage mechanics
Material modeling
Force analysis
Theoretical Mechanics and Applied Mechanics
material science
Semiconductor spin physics and topological phenomena
Semiconductor Nanotechnology and Devices
Wide/narrow bandgap semiconductor
Compound semiconductor
Magnetic semiconductor
Organic semiconductor
Advanced photoresist
Optoelectronic and photovoltaic devices
Semiconductor Physics
Semiconductor quantum computing
Semiconductor Materials and Device Reliability
Semiconductor Manufacturing and Applications
Emerging semiconductor technologies
Intelligent manufacturing
3D semiconductor device technology
sensor
Fully integrated automation
Robotics
automatic detection
I mportant D ates
  • Submission Deadline: 2024.7.1
  • Registration Deadline: 2024.7.10
  • Conference Date: 2024.8.10
  • Notification Date: About a week after the submission
S ubmission P ortal

Mail Address:  iac_info@163.com

If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists:

苏老师

邹teacher

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苏老师:
邹teacher: